MLCC´s in parallel - KEMET - KONNEKT

With the KONNEKT series, Kemet Electronic Coperation is introducing a new MLCC series that is even better than a standard MLCC. A new kind of connection is offering perspicuous advantages compared known technologies.

The innovative "Trans Liquid Phase Sintering (TLPS)" enables a wireless connection between the single MLCCs. In the past, this was done using complex leadframes, but it can now be much smarter.

Kemet currently only has 4 capacitors in the TLPS technology. In the 1812 design, two capacitance values ​​of 940nF and 1.4µF are available. The dielectric strength of these MLCCs in the U2J ceramic type is specified as rated voltage with 50V.

In principle, it is possible to change all MLCCs with this technology so that other CV products can also belong to these connection functions.

Thanks to the new TLPS process, it is not only possible to mount the MLCCs in a horizontal position as before, but also rotated by 90° in a vertical position. Since all chips are directly connected to the board through the assembly, you will have a big advantage to cool down the capacitors.

This makes it possible to apply high ripple currents, which can be up to 35A depending on the frequency. You can find a graphical data of this in the KONNEKT press release.

Typical areas of application are diverse LLC converters, including switched tank converters for e.g. renewable energy such as wind and solar or wireless charging.

If you need further information or samples, please do not hesitate to contact us.