DEGSON DG212 – PUSH-IN Meets Reflow: PCB Terminal Blocks for Automated Manufacturing
Modern electronics manufacturing requires components that combine fast assembly, reliable connection technology, compact dimensions, and compatibility with automated production processes. The DEGSON DG212 series was developed with precisely these requirements in mind.
The compact PCB terminal blocks combine PUSH-IN spring connection technology with Through-Hole Reflow (THR), making the series particularly suitable for industrial electronics, automation technology, energy applications, and other applications with a high degree of manufacturing automation.
Designed for THR and Reflow Processes
The DG212-THR versions are designed for Through-Hole Reflow (THR). This allows the PCB terminal blocks to be assembled and soldered together with SMD components within an automated production process.
Depending on the version, DEGSON specifies reflow soldering, wave soldering, and manual soldering as suitable processing methods.
High-temperature-resistant housing materials enable the terminal blocks to withstand the thermal requirements of the reflow process.
PUSH-IN Technology for Fast Wiring
The DG212 series uses PUSH-IN spring connection technology. Suitable stripped conductors can be connected quickly and securely without conventional screw connection technology.
An operating button simplifies conductor release and can also provide access for electrical testing.
The spring connection system is designed to provide a reliable electrical connection and good resistance to vibration – an important advantage for industrial applications.
Compact Design
Space on modern PCBs is increasingly valuable. This is another area where the DG212 series offers advantages.
For example, the DG212R-THR version with a 3.5 mm pitch has a height of only 8.5 mm. This makes the series particularly suitable for compact control units, I/O modules, drives, and other applications with limited installation space.
Depending on the version, different conductor entry directions are available, providing additional flexibility when designing the PCB and enclosure.
Suitable for Automated PCB Assembly
Selected DG212 versions are available in tape-and-reel packaging, allowing the terminal blocks to be integrated into automated assembly processes.
This makes the DG212 particularly interesting for manufacturers who want to combine SMD assembly, THR components, and automated production in a highly efficient manufacturing process.
Technical Highlights of the DEGSON DG212
| Feature | DG212-THR |
|---|---|
| Connection technology | PUSH-IN spring connection |
| Conductor cross-section | 0.2–1.5 mm² |
| AWG range | AWG 28–14 |
| Pitch | 3.5 mm / 3.81 mm / 5.0 mm depending on version |
| Rated current according to IEC | up to 17.5 A |
| UL rated voltage | up to 300 V depending on version/application group |
| Soldering processes | Reflow / Wave / Manual |
| Packaging | including Tape & Reel |
| Housing | High-temperature-resistant thermoplastic |
| Flammability rating | UL94 V-0 |
| Operating temperature | up to +130 °C depending on version |
The exact electrical ratings depend on the respective DG212 version, pitch, overvoltage category, and pollution degree. The specific product data should therefore always be checked for the selected part number.
Typical Applications
The DG212 series is particularly suitable for applications in industrial automation, drive technology, distributed I/O modules, inverters, renewable energy systems, smart buildings, and compact electronic control units.
Its combination of PUSH-IN connection technology, compact dimensions, and compatibility with automated soldering processes makes the DG212 an interesting solution wherever efficient production and fast field wiring are equally important.
Drawings
- DG212R-THR-3.5-XXP-1Y-1000A&Z(H).pdf (162.2 KiB)
- DG212S-THR-3.5-XXP-1Y-00A(H).pdf (129.5 KiB)
- DG212V-THR-3.5-XXP-1Y-1000A&Z(H).pdf (160.2 KiB)
- DG212V-THR-3.5-XXP-1Y-1000R(H).pdf (287.1 KiB)
- DG212V-THR-3.5-XXP-1Y-1050R(H).pdf (609.7 KiB)
- DG212R-THR-5.0-XXP-1Y-1000A&Z(H).pdf (172.6 KiB)
- DG212S-THR-5.0-XXP-1Y-00A&Z(H).pdf (136.3 KiB)
- DG212V-THR-5.0-XXP-1Y-1000A&Z(H).pdf (135.8 KiB)
- DG212V-THR-5.0-XXP-1Y-1000R(H).pdf (195.0 KiB)
DG212 on YouTube
Frequently Asked Questions About the DEGSON DG212 Series
What is the DEGSON DG212 series?
The DEGSON DG212 series consists of compact PCB terminal blocks with PUSH-IN spring connection technology. The series is designed in particular for applications where fast field wiring needs to be combined with automated PCB manufacturing processes.
Is the DEGSON DG212 suitable for reflow soldering?
Yes. The DG212-THR versions are designed for Through-Hole Reflow (THR). This allows the PCB terminal blocks to be processed together with SMD components during automated PCB manufacturing.
Which conductor sizes can be connected to the DEGSON DG212?
The DG212-THR versions covered here support solid and flexible conductors from 0.2 to 1.5 mm², corresponding to AWG 28 to AWG 14.
What is the rated current of the DEGSON DG212?
Depending on the version, DEGSON specifies a rated current of up to 17.5 A according to IEC. The permissible voltage depends on the specific version, pitch, overvoltage category, and pollution degree.
Which pitch sizes are available for the DEGSON DG212?
The DG212-THR series is available in several versions, including 3.5 mm, 3.81 mm, and 5.0 mm pitch.
How does the PUSH-IN connection of the DG212 work?
Suitable stripped conductors can be inserted directly into the spring connection. The PUSH-IN technology enables fast wiring without a conventional screw connection. An operating button facilitates conductor release.
How compact is the DEGSON DG212?
The DG212R-THR with a 3.5 mm pitch has a height of only 8.5 mm, making it particularly suitable for applications where PCB and enclosure space is limited.
Is the DEGSON DG212 suitable for automated PCB assembly?
Yes. Selected versions are available in tape-and-reel packaging, supporting integration into automated PCB assembly processes.
Which soldering processes can be used with the DG212?
Depending on the version, DEGSON specifies reflow soldering, wave soldering, and manual soldering.
What is the operating temperature range of the DEGSON DG212?
For the DG212R-THR-3.5 version covered by the available technical documentation, an operating temperature range of −40 °C to +130 °C is specified. The permissible load and temperature range should always be checked for the individual part number.
Where can I get technical support for selecting the right DEGSON DG212?
wittig ELECTRONIC supports customers in selecting the appropriate DEGSON DG212 version based on pitch, number of poles, conductor entry direction, conductor cross-section, current and voltage requirements, soldering process, and packaging requirements.