HYE setzt neue Maßstäbe für Rechenzentren: High-Speed-Konnektivität der nächsten Generation

The specialized manufacturer Yueqing Hongyu Electronics Co., Ltd. (HYE), which has been investing heavily in the research and development of high-speed connectors since 2016, presents its expanded portfolio of SFP, QSFP, and DD solutions. With in-house production for stamping dies and injection molds, as well as state-of-the-art automated assembly lines, HYE offers customized solutions to meet the increasing demands of modern network infrastructures.

Product Portfolio at a Glance

HYE’s interconnection systems are characterized by their robustness and compliance with industrial standards such as EIA-364. All connectors are hot-swappable, support an operating voltage of 3.3V, and are designed for a temperature range of -40°C to +85°C.

Here are the key versions and their specific advantages:

SFP, SFP+ & SFP28 (1XN and 2XN)
- Differences: While the classic SFP standard is designed for speeds up to 1 Gbps, SFP+ supports up to 10 Gbps and SFP28 up to 25 Gbps per channel.
- Advantages: These modules use the same compact form factor, enabling seamless upgrades of existing hardware. The 2XN (stacked) versions allow for significantly higher port density on the PCB.
- Options: Available with integrated light pipes and various heat sink options for optimal thermal management.
QSFP28 (1XN & 2XN)
- Differences: QSFP28 (Quad Small Form-factor Pluggable) is designed for 100G applications. It bundles four channels at 25 Gbps each.
- Advantages: It offers four times the bandwidth of an SFP28 module while maintaining high packing density. The housings are specifically keyed to prevent mismating and comply with the QSFP MSA standard.
SFP-DD & QSFP-DD (Double Density)
- Differences: The "Double Density" versions utilize an additional row of contacts to double the number of channels without significantly changing the physical footprint of the port opening.
- Advantages: This technology is key for transitioning to 200G or even 400G networks. A particular advantage is the backward compatibility: SFP-DD ports can still accommodate standard SFP modules, providing investment protection for existing hardware.

Technical Highlights & Materials

For superior electromagnetic compatibility (EMI), HYE relies on housings made of copper alloys or stainless steel with special EMI grounding tabs (spring fingers). The contact areas feature high-quality gold plating (up to 30u' gold coating) to guarantee lossless signal transmission even after many mating cycles.

With this wide range of high-speed solutions, HYE positions itself as a flexible partner for manufacturers of switches, servers, and storage systems worldwide.

Samples, price quotations, short-term delivery options and further information are available via the contact form or from your usual contact person.