ChemiCon goes AI

Successful development of the industry's first aluminium electrolytic capacitors compatible with ‘liquid immersion cooling’ of servers

Nippon Chemi-Con, a leading manufacturer of electronic components, has introduced the world's first aluminium electrolytic capacitors specifically designed for use in liquid immersion cooling (LIC) AI servers. This innovation marks a significant advance for IT infrastructure, particularly for data-intensive applications such as generative AI, digital transformation (DX) and autonomous driving. The new capacitors are now available as test samples, with series production planned for 2025.

Challenges of the AI server

With the rapid spread of AI technologies, the energy consumption of modern servers is increasing significantly. While conventional server racks in cloud data centres consume a maximum of around 10 kW, high-performance computing (HPC) systems for AI applications often require over 20 kW, in some cases even more than 100 kW. This leads to enormous heat generation, which requires efficient cooling methods. Liquid cooling has established itself as a superior alternative to conventional air cooling systems, as it significantly improves energy efficiency (Power Usage Effectiveness, PUE).

Innovation in cooling

The new condensers from Nippon Chemi-Con have been specially developed and tested for immersion in cooling liquids. The cooling solutions tested include fluorine compounds such as 3M FC-40 and hydrocarbons such as Shell S3X and ExxonMobil SpectraSyn Max3.5. Long-term tests have confirmed that the newly designed rubber seals prevent the ingress of cooling liquids into the condensers, significantly extending the service life of the components. Conventional seals often showed weaknesses such as swelling or even partial dissolution in such tests, whereas the new seals (patent pending) showed no changes whatsoever.

Versatile product range

The new capacitors are available in various designs to meet the different requirements of modern AI servers:

• PXL series (SMD, conductive polymer): For use in graphics cards and mainboards, especially for liquid cooling, with a guarantee of 5,000 hours at 105 °C.
  
  
• PSL series (radial, conductive polymer): Also for graphics cards and mainboards, with identical specifications to the PXL series.
  
  
• HXU series (SMD, hybrid): Gasket made of composite material, suitable for oil and liquid cooling and vibration-resistant up to 40G. Guaranteed for 6,000 hours at 125 °C/135 °C, ideal for AI servers and the automotive industry.
  
  
• MHU series (SMD, aluminium electrolyte): Similar to the HXU series, guaranteed for 5,000 hours at 125 °C.
  
  
• KZU series (radial, aluminium electrolyte): Seal made of composite materials, suitable for oil and liquid cooling. Guaranteed for 6,000 hours at 105 °C, ideal for AI servers.
  
  
• KHU series (snap-in, aluminium electrolyte): Supports voltages up to 500 V and large capacities up to cup size 100L (mm), with optional oil resistance treatment. Guaranteed for 3,000 hours at 105 °C.

This product range covers applications from primary side smoothing to CPU and GPU and offers solutions for various requirements in AI servers, automotive and industrial applications.

Environmental friendliness and future prospects

The increasing energy consumption of data centres poses a global environmental challenge, especially in the context of global efforts to achieve CO₂ neutrality. By supporting liquid cooling, the new condensers from Nippon Chemi-Con help to improve the energy efficiency of data centres. The collaboration with leading cooling liquid manufacturers such as 3M, Shell and ExxonMobil underlines the company's commitment to innovative solutions.

‘Our new condensers are a crucial step in addressing the challenges of modern IT infrastructure,’ explains a Nippon Chemi-Con spokesperson. ‘We look forward to providing test samples for interested customers and starting series production next year.’

Conclusion

With the new aluminium electrolytic capacitors, Nippon Chemi-Con is setting a milestone in the development of components for AI servers.

 

Thermal cooling

Cooling accounts for 40-50% of a data centre's power consumption, and efficient thermal cooling helps to reduce power consumption and therefore also CO2 emissions.

Cooling can be roughly divided into air cooling and liquid cooling (commonly referred to as water cooling).

 

Liquid cooling (cold plate)

This is a method of cooling by circulating coolant in pipes. Electronic components and coolant come into contact through pipes and heat sinks so that there is no direct contact between them.

Cooling by immersion in liquid - liquid immersion cooling

With this method, the entire device with the electronic components is cooled by immersion in an insulating and inert solvent. As the coolant comes into direct contact with the electronic components and penetrates the interior, issues such as long-term reliability must be checked.